H10P 72/0616
Monitoring of warpages, curvatures, damages, defects or the like
Official title: {Monitoring of warpages, curvatures, damages, defects or the like}
H10P72/0616 (Monitoring of warpages, curvatures, damages, defects or the like) appears on 1,494 US grants and 1,982 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,494
- Published applications
- 1,982
- Assignees
- 480
- Inventors
- 4,322
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 6 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 3 | 0 |
| 1999 | 8 | 0 |
| 2000 | 9 | 0 |
| 2001 | 11 | 5 |
| 2002 | 16 | 22 |
| 2003 | 23 | 24 |
| 2004 | 27 | 25 |
| 2005 | 25 | 31 |
| 2006 | 23 | 32 |
| 2007 | 16 | 41 |
| 2008 | 23 | 30 |
| 2009 | 14 | 31 |
| 2010 | 27 | 23 |
| 2011 | 24 | 26 |
| 2012 | 21 | 32 |
| 2013 | 14 | 41 |
| 2014 | 30 | 44 |
| 2015 | 29 | 56 |
| 2016 | 38 | 56 |
| 2017 | 48 | 71 |
| 2018 | 65 | 123 |
| 2019 | 103 | 162 |
| 2020 | 132 | 177 |
| 2021 | 142 | 149 |
| 2022 | 109 | 175 |
| 2023 | 135 | 148 |
| 2024 | 112 | 166 |
| 2025 | 146 | 172 |
| 2026 | 94 | 120 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Light irradiation type heat treatment method and heat treatment apparatus29 Sep 2026US 12,751,237 B2SCREEN Holdings Co., Ltd.
- Cylindric decomposition for efficient mitigation of substrate deformation with film deposition and ion implantation29 Sep 2026US 12,751,253 B2APPLIED Materials.Inc.
- Wafer support for measuring wafer geometry15 Sep 2026US 12,740,368 B2Tokyo Electron Limited
- Methods for coating a substrate with magnesium fluoride via atomic layer deposition8 Sep 2026US 12,729,431 B2Corning Incorporated
- Method for predicting defect in semiconductor device8 Oct 2026US 2026/0309768 A1Samsung Electronics Co., Ltd.
- Method for fabricating a semiconductor device using heat treatment apparatus8 Oct 2026US 2026/0314299 A1Samsung Electronics Co., Ltd.
- Substrate processing apparatus8 Oct 2026US 2026/0314305 A1Ebara Corporation
- Operation method and device for cleaning foup8 Oct 2026US 2026/0314317 A1Asia Neo Tech Industrial Co., Ltd.
- Optical semiconductor defect detection1 Oct 2026US 2026/0298841 A1Intel Corporation
Most cited
By later US patents
- Transfer module for bowed wafers397US 9,355,882 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Processing systems and methods for halide scavenging218US 9,153,442 B2APPLIED Materials.Inc. · 2015
- Resilient contact structures for interconnecting electronic devices194US 6,778,406 B2FormFactor, Inc. · 2004
- Automated wafer defect inspection system and a process of performing such inspection187US 6,324,298 B1August Technology Corp. · 2001
- Processing systems and methods for halide scavenging184US 9,023,732 B2APPLIED Materials.Inc. · 2015