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US 6,778,406 B2Granted
Resilient contact structures for interconnecting electronic devices
AssigneeFormFactor, Inc.
InventorsBenjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
Life of this patent
Estimating the term…
Abstract
Resilient contact structures provide electrical interconnection between a semiconductor die and another electronic component. Multilayered packaging may be formed on the semiconductor die, and the resilient contact structures may be formed on portions of one or more of the layers. Heat dissipating structures may be provided on the die.
Claims23
Electronic assembly, comprising:
- a first plurality of semiconductor dies mounted edge-to-edge, in close proximity to one another, on a first side of a printed circuit board, each semiconductor die electrically connected to the printed circuit board by spring contact structures mounted to each of the semiconductor dies.
Semiconductor package, comprising:
- a first insulating layer;
- a first conductive layer disposed on a first surface of the first insulating layer and patterned to have a first plurality of conductive traces;
- a second insulating layer disposed on said first conductive layer;
- a second conductive layer disposed on a first surface of the second insulating layer and patterned to have a second plurality of conductive traces;
- the second conductive and insulating layers are arranged and disposed so that outer portions of the first plurality of conductive traces are exposed;
- a first plurality of electrical contact structures mounted to outer portions of the first plurality of conductive traces;
- and
- a second plurality of electrical contact structures mounted to the second plurality of conductive traces.
5 more elements
Semiconductor package, comprising:
- a first insulating layer;
- a first conductive layer disposed on a first surface of the first insulating layer and patterned to have a first plurality of conductive traces;
- a second insulating layer;
- a second conductive layer disposed on a first surface of the second insulating layer and patterned to have a second plurality of conductive traces;
- the first conductive layer being in contact with the second insulating layer;
- the second conductive and insulating layers are arranged and disposed so that outer portions of the first plurality of conductive traces are exposed;
- a first plurality of electrical contact structures mounted to outer portions of the first plurality of conductive traces;
- a second plurality of electrical contact structures mounted to the second plurality of conductive traces;
- and
- means for receiving a semiconductor device;
- wherein:
- the second conductive and insulating layers are arranged and disposed so that inner portions of the first plurality of conductive traces are exposed for connecting to a semiconductor device;
- and
- further comprising:
- means for connecting the semiconductor device to the exposed inner portions of the first plurality of conductive traces;
- and
- means for connecting the semiconductor device to the second plurality of conductive traces.
14 more elements
Semiconductor device, comprising:
- a semiconductor die having a front surface and a back surface;
- a plurality of elongate, spring interconnect structures mounted to the front surface of the semiconductor die;
- and
- a heat-dissipating structure mounted to the back surface of the semiconductor die.
1 more element
Semiconductor device, comprising:
- a semiconductor die having a front surface and a back surface;
- and
- a plurality of spring contact structures mounted to the front surface of the semiconductor die.
Dependencies are inferred from the claim text.