Transfer module for bowed wafers

A wafer handling system comprising:

• a robot arm comprising a suction board at one end, the suction board configured to hold a wafer;
• a table within reach of the robot arm, wherein the table comprises an upper surface configured to support the wafer, and comprises a vacuum area configured to hold the wafer against the upper surface;
• and
• a pusher coupled to the robot arm and extending about a periphery of the suction board, wherein the pusher is configured to press a periphery of the wafer against the upper surface of the table.

A wafer handling system comprising:

• a carousel supporting a first table, wherein the carousel is configured to rotate about a central axis, and wherein the first table is laterally offset from the central axis, is configured to support a wafer, and comprises a vacuum area configured to hold the wafer against the first table;
• a second table arranged laterally adjacent to the carousel, wherein the second table comprises an upper surface configured to support the wafer, and further comprises a vacuum manifold configured to hold the wafer against the upper surface, wherein the vacuum manifold is arranged at a center of the upper surface and comprises a trench in the upper surface, and wherein the vacuum manifold has a width less than about a half of a width of the wafer;
• and
• a robot arm within reach of the first and second tables, and configured to move the wafer between the first and second tables.