Processing systems and methods for halide scavenging

A method of processing a substrate, the method comprising:

• transferring a substrate from a holding chamber to a loading chamber through a factory interface with a first transfer device;
• evacuating the loading chamber such that the substrate is maintained in a vacuum environment;
• transferring the substrate from the evacuated loading chamber to a process chamber with a second transfer device;
• transferring the substrate from the process chamber to the loading chamber with the second transfer device;
• removing the vacuum conditions from the loading chamber;
• transferring the substrate to a wet etching station using the first transfer device, wherein the wet etching station is coupled with the factory interface and is accessible by the first transfer device;
• and
• transferring the substrate from the loading chamber to a storage chamber with the first transfer device.