H10P 72/0604
Process monitoring
Official title: {Process monitoring, e.g. flow or thickness monitoring}
H10P72/0604 (Process monitoring) appears on 3,361 US grants and 4,361 published applications in this corpus.
Search patents in H10P- Granted patents
- 3,361
- Published applications
- 4,361
- Assignees
- 680
- Inventors
- 8,190
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 6 | 0 |
| 1991 | 2 | 0 |
| 1992 | 6 | 0 |
| 1993 | 10 | 0 |
| 1994 | 13 | 0 |
| 1995 | 5 | 0 |
| 1996 | 7 | 0 |
| 1997 | 6 | 0 |
| 1998 | 13 | 0 |
| 1999 | 26 | 0 |
| 2000 | 40 | 0 |
| 2001 | 45 | 41 |
| 2002 | 86 | 86 |
| 2003 | 95 | 134 |
| 2004 | 109 | 176 |
| 2005 | 94 | 142 |
| 2006 | 93 | 116 |
| 2007 | 81 | 110 |
| 2008 | 62 | 109 |
| 2009 | 54 | 94 |
| 2010 | 61 | 69 |
| 2011 | 82 | 82 |
| 2012 | 71 | 58 |
| 2013 | 56 | 54 |
| 2014 | 61 | 64 |
| 2015 | 47 | 99 |
| 2016 | 68 | 139 |
| 2017 | 97 | 159 |
| 2018 | 123 | 247 |
| 2019 | 181 | 288 |
| 2020 | 227 | 310 |
| 2021 | 236 | 303 |
| 2022 | 205 | 339 |
| 2023 | 244 | 323 |
| 2024 | 282 | 318 |
| 2025 | 276 | 296 |
| 2026 | 181 | 205 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method to perform in-situ vacuum contamination measurement and identification in arbitrarily large chambers29 Sep 2026US 12,751,233 B2KLA Corporation
- Film thickness measuring device and film thickness measuring method22 Sep 2026US 12,742,637 B2Hamamatsu Photonics K.K.
- Reticle-like sensing assembly22 Sep 2026US 12,743,018 B2Microprogram Information Co., Ltd.
- Information processing system, power adjustment method, and heat treatment apparatus22 Sep 2026US 12,745,589 B2Tokyo Electron Limited
- Substrate processing apparatus and substrate processing method22 Sep 2026US 12,745,590 B2Tokyo Electron Limited
- Semiconductor wafer processing tool with improved leak check8 Oct 2026US 2026/0314308 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate marking apparatus and substrate marking method using the same8 Oct 2026US 2026/0314310 A1Samsung Electronics Co., Ltd.
- Method of cleaning a nozzle8 Oct 2026US 2026/0314314 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Zone-based cmp target control1 Oct 2026US 2026/0295766 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Voltage contrast for backside processes on wafers1 Oct 2026US 2026/0299019 A1Intel Corporation
Most cited
By later US patents
- Phase-stabilized thin films, structures and devices including the thin films, and methods of forming same536US 9,029,253 B2ASM IP Holding B. V. · 2015
- Method for managing UV irradiation for curing semiconductor substrate529US 7,501,292 B2ASM Japan K .K. · 2009
- Substrate processing apparatus and substrate processing method517US 6,656,281 B1Tokyo Electron Limited · 2003
- Substrate treatment method and substrate treatment apparatus473US 9,698,031 B2SCREEN Holdings Co., Ltd. · 2017
- Heat treatment equipment471US 7,850,449 B2Samsung Electronics Co., Ltd. · 2010