Information processing system, power adjustment method, and heat treatment apparatus

A power adjustment method comprising:

• providing an information processing system including:
• a heat treatment apparatus configured to form a film on a processing target substrate by using a heater that heats the processing target substrate inside a processing container;
• and
• an information processing apparatus configured to control power supplied to the heater,
• predicting an influence of a cumulative film adhering inside the processing container, on a temperature of the processing target substrate by using a simulation model of the heat treatment apparatus;
• and
• adjusting the power supplied to the heater based on the predicted influence of the cumulative film adhering inside the processing container, on the temperature of the processing target substrate,
• wherein the predicting includes
• outputting a virtual power supplied to the simulation model of the heat treatment apparatus based on a set temperature in the processing container and a predicted temperature in the processing container;
• and
• outputting the predicted temperature in the processing container, based on at least one of the power supplied to the heater or the virtual power, by using the simulation model of the heat treatment apparatus, and
• the adjusting includes;
• determining the virtual power at which the predicted temperature of the processing target substrate inside the processing container approaches the set temperature in the processing container, by using the simulation model to which a transmittance of the cumulative film adhering inside the processing container is applied;
• and
• adjusting the power supplied to the heater based on the predicted temperature and the virtual power.

A heat treatment apparatus comprising:

• a processing container configured to accommodate a processing target substrate;
• a heater configured to heat the processing target substrate inside the processing container;
• a prediction circuitry configured to predict an influence of a cumulative film adhering inside the processing container, on a temperature of the processing target substrate by using a simulation model of the heat treatment apparatus;
• and
• an adjustment circuitry configured to adjust power supplied to the heater based on the predicted influence of the cumulative film adhering inside the processing container, on the temperature of the processing target substrate,
• wherein the prediction circuitry includes
• a virtual power output circuitry configured to output a virtual power supplied to the simulation model of the heat treatment apparatus based on a set temperature in the processing container and a predicted temperature in the processing container;
• and
• a temperature prediction circuitry configured to output the predicted temperature in the processing container, based on at least one of the power supplied to the heater or the virtual power, by using the simulation model of the heat treatment apparatus, and the adjustment circuitry is configured to
• determine the virtual power at which the predicted temperature of the processing target substrate inside the processing container approaches the set temperature in the processing container, by using the simulation model to which a transmittance of the cumulative film adhering inside the processing container is applied;
• and
• adjust the power supplied to the heater based on the predicted temperature and the virtual power.