H10P 72/0602
Temperature monitoring
Official title: {Temperature monitoring}
H10P72/0602 (Temperature monitoring) appears on 2,617 US grants and 3,649 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,617
- Published applications
- 3,649
- Assignees
- 535
- Inventors
- 6,046
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 17 | 0 |
| 2000 | 35 | 0 |
| 2001 | 40 | 18 |
| 2002 | 33 | 41 |
| 2003 | 39 | 46 |
| 2004 | 47 | 80 |
| 2005 | 39 | 76 |
| 2006 | 36 | 73 |
| 2007 | 36 | 70 |
| 2008 | 39 | 78 |
| 2009 | 25 | 83 |
| 2010 | 31 | 62 |
| 2011 | 60 | 56 |
| 2012 | 59 | 67 |
| 2013 | 55 | 80 |
| 2014 | 63 | 85 |
| 2015 | 70 | 111 |
| 2016 | 60 | 129 |
| 2017 | 99 | 157 |
| 2018 | 119 | 215 |
| 2019 | 158 | 283 |
| 2020 | 185 | 315 |
| 2021 | 227 | 271 |
| 2022 | 196 | 285 |
| 2023 | 209 | 288 |
| 2024 | 229 | 260 |
| 2025 | 237 | 265 |
| 2026 | 148 | 155 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Mitigation of capillary pattern collapse in supercritical dry6 Oct 2026US 12,757,666 B2Tokyo Electron Limited
- Plasma processing device and plasma processing method6 Oct 2026US 12,757,669 B2Hitachi High-Tech Corporation
- Rapid and precise temperature control for thermal etching6 Oct 2026US 12,757,675 B2Lam Research Corporation
- Light irradiation type heat treatment method and heat treatment apparatus29 Sep 2026US 12,751,237 B2SCREEN Holdings Co., Ltd.
- Reticle-like sensing assembly22 Sep 2026US 12,743,018 B2Microprogram Information Co., Ltd.
- Self-powered wireless telemtry for wafer temperature measurements1 Oct 2026US 2026/0298723 A1Siemens Aktiengesellschaft
- Substrate processing apparatus1 Oct 2026US 2026/0305229 A1SCREEN Holdings Co., Ltd.
- Systems and methods for determining when to trigger an abort process during semiconductor fabrication processing24 Sep 2026US 2026/0287676 A1ASM IP Holding B. V.
- Solder reflow with optical endpoint control24 Sep 2026US 2026/0293585 A1Yield Engineering Systems, Inc.
- Temperature-controlled pedestal for semiconductor wafer processing24 Sep 2026US 2026/0293611 A1Lam Research Corporation
Most cited
By later US patents
- Wafer processing cluster tool batch preheating and degassing apparatus663US 5,259,881 AMaterials Research Corporation · 1993
- Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support659US 6,847,014 B1Lam Research Corporation · 2005
- Temperature control system for semiconductor process chamber652US 6,015,465 AAPPLIED Materials.Inc. · 2000
- Temperature control system for process chamber628US 6,326,597 B1APPLIED Materials.Inc. · 2001
- Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment622US 4,821,674 A1989