Self-powered wireless telemtry for wafer temperature measurements

Abstract

A telemetry system is configured to monitor temperature of a wafer disposed in a vacuum. The system can include a plurality of sensors configured to measure temperature at a plurality of locations across the wafer. The system can further include a plurality of sensor signal conditioning circuits. Each sensor signal conditioning circuit can be coupled to a respective sensor of the plurality of sensors. The plurality of sensor signal conditioning circuits can be configured to convert a resistance from each sensor of the plurality of sensors into low frequency sinusoids that define a respective frequency that is proportional to the resistance. The system can further include a multiplexor configured to generate a composite modulating signal from the low frequency sinusoids. The system can further include a frequency modulation (FM) transmitter configured to send the composite modulating signal outside of the vacuum.

Dependencies are inferred from the claim text.