H10P 72/0612
Production flow monitoring
Official title: {Production flow monitoring, e.g. for increasing throughput}
H10P72/0612 (Production flow monitoring) appears on 1,137 US grants and 1,251 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,137
- Published applications
- 1,251
- Assignees
- 280
- Inventors
- 2,521
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 7 | 0 |
| 1996 | 5 | 0 |
| 1997 | 8 | 0 |
| 1998 | 13 | 0 |
| 1999 | 18 | 0 |
| 2000 | 24 | 0 |
| 2001 | 36 | 13 |
| 2002 | 28 | 51 |
| 2003 | 47 | 69 |
| 2004 | 66 | 78 |
| 2005 | 61 | 62 |
| 2006 | 58 | 49 |
| 2007 | 37 | 55 |
| 2008 | 37 | 53 |
| 2009 | 33 | 54 |
| 2010 | 34 | 35 |
| 2011 | 34 | 41 |
| 2012 | 35 | 24 |
| 2013 | 33 | 22 |
| 2014 | 35 | 27 |
| 2015 | 24 | 24 |
| 2016 | 19 | 29 |
| 2017 | 30 | 27 |
| 2018 | 19 | 37 |
| 2019 | 31 | 62 |
| 2020 | 39 | 53 |
| 2021 | 56 | 75 |
| 2022 | 45 | 74 |
| 2023 | 43 | 72 |
| 2024 | 63 | 68 |
| 2025 | 53 | 76 |
| 2026 | 36 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus and method for dispensing treatment liquid29 Sep 2026US 12,751,239 B2Semes Co., Ltd.
- Multi-target design for in-situ analysis of semiconductor fabrication process29 Sep 2026US 12,751,240 B2APPLIED Materials.Inc.
- Substrate processing apparatus and substrate processing method29 Sep 2026US 12,751,246 B2Tokyo Electron Limited
- Transport system25 Aug 2026US 12,715,481 B2Murata Machinery, Ltd.
- Conveyance system, method for controlling conveyance system, and storage medium25 Aug 2026US 12,715,488 B2Daifuku Co., Ltd.
- Prediction device and etching control system8 Oct 2026US 2026/0314298 A1Tokyo Electron Limited
- System and method for semiconductor cleaning operation17 Sep 2026US 2026/0282814 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of displaying substrate arrangement data, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus10 Sep 2026US 2026/0271661 A1Kokusai Electric Corporation
- Transport apparatus and adapter pendant16 Jul 2026US 2026/0206540 A1Brooks Automation US, LLC
- Apparatus and method for processing substrate2 Jul 2026US 2026/0186459 A1Semes Co., Ltd.
Most cited
By later US patents
- Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool656US 6,201,999 B1APPLIED Materials.Inc. · 2001
- Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot619US 6,074,443 AAPPLIED Materials.Inc. · 2000
- Device for controlling processing system, method for controlling processing system and computer-readable storage medium stored processing program542US 8,055,378 B2Tokyo Electron Limited · 2011
- Semiconductor substrate transfer apparatus and semiconductor substrate processing apparatus equipped with the same540US 7,618,226 B2ASM Japan K .K. · 2009
- Method and system to process semiconductor wafers487US 6,732,006 B2ASM International N.V. · 2004