H10P 56/00
Debonding of wafers, substrates or parts of devices
H10P56/00 (Debonding of wafers, substrates or parts of devices) appears on 11 US grants and 24 published applications in this corpus.
Search patents in H10P- Granted patents
- 11
- Published applications
- 24
- Assignees
- 16
- Inventors
- 58
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2014 | 0 | 1 |
| 2015 | 1 | 1 |
| 2016 | 0 | 2 |
| 2017 | 1 | 0 |
| 2018 | 4 | 3 |
| 2019 | 1 | 2 |
| 2020 | 1 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 3 |
| 2026 | 2 | 10 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Substrate processing apparatus and substrate processing method25 Aug 2026US 12,721,107 B2Tokyo Electron Limited
- Multi-layer release stack for light induced transfer of components12 May 2026US 12,628,482 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Wafer debonding system and method12 Jan 2021US 10,889,097 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer debonding system and method25 Feb 2020US 10,569,520 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing semiconductor substrate24 Sep 2019US 10,424,514 B2Mtec Corporation
- Intermolecular de-bondable wafer bonding for advanced packaging1 Oct 2026US 2026/0305191 A1Micron Technology, Inc.
- Release agent composition for release by irradiation with light, laminate, and method for producing processed semiconductor substrate17 Sep 2026US 2026/0275170 A1Nissan Chemical Corporation
- Production method of semiconductor device17 Sep 2026US 2026/0282554 A1Tokyo Electron Limited
- Methods and assemblies for removing a die from a foil10 Sep 2026US 2026/0271668 A1Ismeca Semiconductor Holding SA
- Method for processing a bonded wafer and processing apparatus3 Sep 2026US 2026/0262461 A1Disco Corporation
Most cited
By later US patents
- Thin epitaxial silicon carbide wafer fabrication8US 9,761,493 B2Rutgers, The State University of New Jersey · 2017
- Bond and release layer transfer process6US 10,164,144 B2QMAT, Inc. · 2018
- Wafer debonding system and method4US 10,569,520 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2020
- Wafer support system and method for separating support substrate from solid-phase bonded wafer and method for manufacturing semiconductor device4US 9,147,599 B2Fuji Electric Co., Ltd. · 2015
- Wafer debonding system and method3US 10,155,369 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018