Mtec Corporation
Aichi, JP· latest recorded location
MTEC CORPORATION is named on 2 US grants and 5 published applications in this corpus. Its most frequent classification is B01F (Mixing).
- Granted patents
- 2
- Published applications
- 5
- Inventors
- 7
- Granted in 2026 so far
- 0
- Most recent grant
- 22 Nov 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2014 | 0 | 2 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 2 |
| 2022 | 1 | 0 |
By publication year.
Technology areas
Share of 7 documents
- B01FMixing3
- B23KSoldering or unsoldering2
- H01RElectrically-conductive connections2
- H10DInorganic electric semiconductor devices2
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered2
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by2
- B29CShaping or joining of plastics1
- G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure1
- H01GCapacitors1
- H05KPrinted circuits1
Recent patents
- Gas-liquid mixing device22 Nov 2022US 11,504,679 B2
- Method for manufacturing semiconductor substrate24 Sep 2019US 10,424,514 B2
- Gas-liquid mixing device9 Dec 2021US 2021/0379544 A1
- Gas-liquid mixing device15 Jul 2021US 2021/0213400 A1
- Method for manufacturing semiconductor substrate15 Feb 2018US 2018/0047630 A1
- Resin molded product and method for producing same13 Mar 2014US 2014/0069716 A1
- Structure for connecting element to conductive member6 Feb 2014US 2014/0038454 A1
Most cited
By later US patents