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AssigneesMtec Corporation, Iriso Electronics Co., Ltd.
InventorsYujiro Sugaya, Mitsuharu Kato
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A resin molded product for reducing the external force applied to a first element from each electroconductive member due to a pressure of a resin at the time of molding, when each of the electroconductive members and the first element are insert-molded with the resin, and a method for producing the same. A second element fixing the electroconductive members to each other is connected to each of the electroconductive members so as to lie astride each of the electroconductive members. Accordingly, even though a pressure of the resin which flows into a die has been applied to each of the electroconductive members when a resin part that covers each of the electroconductive members and the first element is formed by insert molding, the distortion occurring among each of the electroconductive members is reduced by the second element.
A resin molded product having a plurality of electroconductive members arranged spaced apart from each other in a width direction, a first element arranged astride each of the electroconductive members, and a resin part configured to cover each of the electroconductive members and the first element, comprising:
A method for producing a resin molded product by arranging a first element so as to lie astride each electroconductive member above a plurality of the electroconductive members which are arranged at spaces from each other in a width direction, and forming a resin part which covers each of the electroconductive members and the first element, by insert molding, comprising:
Dependencies are inferred from the claim text.