Methods and assemblies for removing a die from a foil
AssigneeIsmeca Semiconductor Holding SA
InventorsFabio Depetris, Adrien Bardoux, Giovanni Palmisano
Life of this patent
Estimating the term…
Loading patent…
AssigneeIsmeca Semiconductor Holding SA
InventorsFabio Depetris, Adrien Bardoux, Giovanni Palmisano
Estimating the term…
According to the present invention there is provided a method of removing a die (2) from a foil (3), comprising the steps of, (a) providing a foil (3) which has a first surface (3a) and a second, opposite surface (3b) wherein the foil (3) has one or more die (2) attached to the first surface (3a); (b) aligning a vibration member (6) with a die (2) which is to be removed from the foil; (c) while maintaining said alignment moving the vibration member (6) to bring it into contact with the second surface (3b) of the foil (3); (d) continuing to move the vibration member (6) from a start position, a predefined distance in a direction towards the foil (3); (e) vibrating the vibration member (6), to generate vibrations in the foil (3) which loosen the die (2) from the first surface (3a) of the foil (3); (f) picking the loosened die (2) from the first surface (3a) of the foil (3). There is further provided a corresponding assembly (1) which can be used to perform the method.
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
An assembly comprising:
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
An assembly comprising:
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
Dependencies are inferred from the claim text.