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US 2026/0275170 A1Published application
Release agent composition for release by irradiation with light, laminate, and method for producing processed semiconductor substrate
AssigneeNissan Chemical Corporation
InventorsMasafumi YAGYU, Tetsuya SHINJO
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Abstract
This release agent composition for release by irradiation with light includes a polymer and a solvent, the polymer including a first structure, a second structure, and a third structure, wherein the first structure has a structure that absorbs light to impart releasability to a release agent layer formed from the release agent composition, the second structure has a —Si—O—Si— structure in a main chain of the polymer, and the third structure has an aromatic hydrocarbon ring and/or a heterocyclic ring.
Claims10
A release agent composition for release by irradiation with light, comprising
- a polymer and a solvent,
- the polymer comprising a first structure, a second structure, and a third structure, wherein
- the first structure has a structure that absorbs light to impart releasability to a release agent layer formed from the release agent composition,
- the second structure has a —Si—O—Si— structure in a main chain of the polymer, and
- the third structure has an aromatic hydrocarbon ring and/or a heterocyclic ring.
2 more elements
Dependencies are inferred from the claim text.