Intermolecular de-bondable wafer bonding for advanced packaging

Abstract

Intermolecular de-bondable wafer bonding for advanced packaging is disclosed herein. A method of preparing a device wafer includes bonding the device wafer to a carrier wafer, processing the device wafer, and debonding the device wafer from the carrier wafer. Bonding can include depositing first and second intermolecular bond (IMB) layers on the carrier wafer and the device wafer, respectively, and moving the carrier and/or device wafers toward one another such that the first and second IMB layers form an intermolecular bond therebetween. Debonding can include bringing a conductive material adjacent to at least one of the first IMB layer, the second IMB layer, or the device wafer, thereby weakening the intermolecular bond formed between the first IMB layer and the second IMB layer, and separating the first and second IMB layers from one another, thereby separating the device wafer from the carrier wafer.

Dependencies are inferred from the claim text.