Wafer debonding system and method

A debonding apparatus for debonding a pair of bonded substrates, comprising:

• a wafer chuck configured to hold a first substrate of the pair of bonded substrates;
• a pair of separating blades including a first separating blade and a second separating blade that are configured to be placed at edges of the pair of bonded substrates;
• and
• a flex wafer assembly comprising a first pulling head and a second pulling head, wherein the first pulling head and the second pulling head are configured to be placed above the pair of bonded substrates and to hold and move a second substrate of the pair of bonded substrates separated from the first substrate.

A debonding apparatus for debonding a pair of bonded substrates, comprising:

• a wafer chuck configured to hold a first substrate of the pair of bonded substrates;
• a pair of separating blades including a first separating blade and a second separating blade configured to be inserted between the first substrate and a second substrate of the pair of bonded substrate from edges of the pair of bonded substrates;
• and
• a flex wafer assembly comprising a first pulling head and a second pulling head, wherein the first pulling head and the second pulling head are configured to hold and pull the second substrate upward until the flex wafer assembly flexes the second substrate from the first substrate.