H10P 36/00
Gettering within semiconductor bodies
H10P36/00 (Gettering within semiconductor bodies) appears on 1,399 US grants and 1,195 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,399
- Published applications
- 1,195
- Assignees
- 343
- Inventors
- 2,210
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 4 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 5 | 0 |
| 1981 | 6 | 0 |
| 1982 | 8 | 0 |
| 1983 | 8 | 0 |
| 1984 | 5 | 0 |
| 1985 | 6 | 0 |
| 1986 | 14 | 0 |
| 1987 | 11 | 0 |
| 1988 | 4 | 0 |
| 1989 | 12 | 0 |
| 1990 | 12 | 0 |
| 1991 | 12 | 0 |
| 1992 | 15 | 0 |
| 1993 | 14 | 0 |
| 1994 | 14 | 0 |
| 1995 | 23 | 0 |
| 1996 | 21 | 0 |
| 1997 | 11 | 0 |
| 1998 | 20 | 0 |
| 1999 | 39 | 0 |
| 2000 | 42 | 0 |
| 2001 | 44 | 21 |
| 2002 | 55 | 50 |
| 2003 | 64 | 63 |
| 2004 | 41 | 41 |
| 2005 | 28 | 59 |
| 2006 | 39 | 43 |
| 2007 | 34 | 52 |
| 2008 | 29 | 48 |
| 2009 | 31 | 63 |
| 2010 | 45 | 57 |
| 2011 | 47 | 44 |
| 2012 | 43 | 47 |
| 2013 | 50 | 35 |
| 2014 | 48 | 59 |
| 2015 | 43 | 50 |
| 2016 | 66 | 70 |
| 2017 | 49 | 57 |
| 2018 | 42 | 45 |
| 2019 | 60 | 42 |
| 2020 | 41 | 55 |
| 2021 | 49 | 48 |
| 2022 | 38 | 38 |
| 2023 | 30 | 34 |
| 2024 | 26 | 33 |
| 2025 | 31 | 27 |
| 2026 | 12 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Silicon carbide epitaxial substrate and method of manufacturing silicon carbide semiconductor device1 Sep 2026US 12,727,400 B2Sumitomo Electric Industries, Ltd.
- Processing method of bonded wafer25 Aug 2026US 12,721,072 B2Disco Corporation
- Process for manufacturing a monocrystalline silicon semiconductor wafer, and monocrystalline silicon semiconductor wafer14 Jul 2026US 12,680,189 B2Siltronic AG
- Detachable temporary substrate compatible with very high temperatures and process for transferring a working layer from the substrate28 Apr 2026US 12,615,998 B2Soitec
- Method for manufacturing group III nitride semiconductor substrate14 Apr 2026US 12,604,680 B2Sumco Corporation
- Photonic substrate preparation method and photonic waveguide preparation or fabrication method1 Oct 2026US 2026/0299200 A1Ecole Polytechnique Federale De Lausanne (Epfl)
- Production method of semiconductor device17 Sep 2026US 2026/0282554 A1Tokyo Electron Limited
- Semiconductor device6 Aug 2026US 2026/0231514 A1Fuji Electric Co., Ltd.
- Method for producing a semiconductor structure comprising an interface region including agglomerates6 Aug 2026US 2026/0231696 A1Commissariat à I' énergie atomique et aux énergies alternatives
- Contaminant collection on soi25 Jun 2026US 2026/0182025 A1Texas Instruments Incorporated
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Method for producing semiconductor substrate513US 5,854,123 ACanon Kabushiki Kaisha · 1998
- Process for fabricating thin film transistor433US 5,529,937 ASemiconductor Energy Laboratory Co.Ltd. · 1996
- Methods and devices for fabricating and assembling printable semiconductor elements382US 7,982,296 B2The Board of Trustees of the University of Illinois · 2011