H10P 54/00
Cutting or separating of wafers, substrates or parts of devices
H10P54/00 (Cutting or separating of wafers, substrates or parts of devices) appears on 6,796 US grants and 8,220 published applications in this corpus.
Search patents in H10P- Granted patents
- 6,796
- Published applications
- 8,220
- Assignees
- 1,153
- Inventors
- 9,936
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 10 | 0 |
| 1978 | 12 | 0 |
| 1979 | 8 | 0 |
| 1980 | 9 | 0 |
| 1981 | 6 | 0 |
| 1982 | 5 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 5 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 7 | 0 |
| 1989 | 3 | 0 |
| 1990 | 8 | 0 |
| 1991 | 7 | 0 |
| 1992 | 6 | 0 |
| 1993 | 13 | 0 |
| 1994 | 5 | 0 |
| 1995 | 17 | 0 |
| 1996 | 12 | 0 |
| 1997 | 14 | 0 |
| 1998 | 20 | 0 |
| 1999 | 50 | 0 |
| 2000 | 44 | 0 |
| 2001 | 54 | 22 |
| 2002 | 67 | 69 |
| 2003 | 66 | 82 |
| 2004 | 70 | 113 |
| 2005 | 80 | 199 |
| 2006 | 97 | 191 |
| 2007 | 89 | 155 |
| 2008 | 98 | 194 |
| 2009 | 120 | 159 |
| 2010 | 171 | 181 |
| 2011 | 157 | 173 |
| 2012 | 134 | 175 |
| 2013 | 165 | 268 |
| 2014 | 275 | 377 |
| 2015 | 392 | 484 |
| 2016 | 450 | 568 |
| 2017 | 543 | 619 |
| 2018 | 458 | 484 |
| 2019 | 439 | 504 |
| 2020 | 480 | 566 |
| 2021 | 455 | 574 |
| 2022 | 391 | 474 |
| 2023 | 389 | 459 |
| 2024 | 332 | 433 |
| 2025 | 347 | 394 |
| 2026 | 193 | 303 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10P 54/50Cutting or separating of wafers, substrates or parts of devices: by scoring146
- H10P 54/20Cutting or separating of wafers, substrates or parts of devices: by laser8
- H10P 54/90Auxiliary processes or arrangements7
- H10P 54/40Cutting or separating of wafers, substrates or parts of devices: by sawing6
- H10P 54/30Cutting or separating of wafers, substrates or parts of devices: by forming2
Recent patents
- Memory device package having scribe line and method for manufacturing the same6 Oct 2026US 12,757,742 B2Nanya Technology Corporation
- Laser processing apparatus for performing desired processing on a workpiece29 Sep 2026US 12,746,617 B2Disco Corporation
- Photonic integrated circuit chip facet preparation via laser-based dicing29 Sep 2026US 12,751,230 B2IonQ, Inc.
- Edge structure of semiconductor wafer and manufacturing method thereof29 Sep 2026US 12,751,231 B2United Microelectronics Corp.
- Method for producing a detachment region in a solid-state body22 Sep 2026US 12,741,341 B2Siltectra GmbH
- Die edge structure for molding compound filling and the methods of forming the same8 Oct 2026US 2026/0314288 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Plasma diced wafers and methods thereof8 Oct 2026US 2026/0314321 A1UTAC Headquarters Pte. Ltd.
- Reticle layout with plasma-etch wafer dicing1 Oct 2026US 2026/0305210 A1
- Package structure and method of manufacturing the same1 Oct 2026US 2026/0305211 A1Advanced Semiconductor Engineering, Inc.
- Stock roll for protective film transfer, protective film arranging method, and chip manufacturing method1 Oct 2026US 2026/0305212 A1Disco Corporation
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Packaged semiconductor device with a molding compound and a method of forming the same1,039US 9,000,584 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package with metal-insulator-metal capacitor and method of manufacturing the same1,021US 9,263,511 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Discrete polymer in fan-out packages731US 9,666,502 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Fan-out PoP structure with inconsecutive polymer layer720US 9,461,018 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2016