Photonic integrated circuit chip facet preparation via laser-based dicing

A method for preparing photonic integrated circuits (PICs), comprising:

• coupling a dicing tape to a first side of a wafer;
• performing a first laser processing step to form a modified layer by applying at least one laser beam of a wavelength that has transmissivity through the wafer along a first projected dicing line in a first direction to define a first facet;
• performing a second laser processing step to form the modified layer by applying the at least one laser beam to the wafer along a second projected dicing line in the first direction to define a second facet, wherein the second projected dicing line is parallel to the first projected dicing line, wherein the first projected dicing line defines a first boundary of a first PIC chip and the second projected dicing line defines a second boundary of a second PIC chip facing the first PIC chip;
• and
• expanding the dicing tape in a second direction to divide the wafer from the modified layer along at least the first projected dicing line and the second projected dicing line into PIC chips, wherein the second direction is perpendicular to the first direction.