Package structure and method of manufacturing the same

Abstract

A package structure and a method of manufacturing a package structure are provided. The method includes providing a structure including a substrate and a metal-containing structure over the substrate; applying a first laser beam to a first surface of the structure, the first laser beam having a first beam size and at least a first intensity; applying a second laser beam to the first surface of the structure, wherein the second laser beam has a second beam size less than the first beam size and a second intensity higher than the first intensity; and breaking the structure from a second surface opposite to the first surface of the structure.

Dependencies are inferred from the claim text.