H10P 54/20
Cutting or separating of wafers, substrates or parts of devices: by laser
Official title: by laser cutting
H10P54/20 (Cutting or separating of wafers, substrates or parts of devices: by laser) appears on 8 US grants and 31 published applications in this corpus.
Search patents in H10P- Granted patents
- 8
- Published applications
- 31
- Assignees
- 17
- Inventors
- 83
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2019 | 0 | 2 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 1 |
| 2023 | 0 | 2 |
| 2024 | 1 | 7 |
| 2025 | 0 | 4 |
| 2026 | 5 | 15 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Laser processing apparatus for performing desired processing on a workpiece29 Sep 2026US 12,746,617 B2Disco Corporation
- Photonic integrated circuit chip facet preparation via laser-based dicing29 Sep 2026US 12,751,230 B2IonQ, Inc.
- Method of processing SiC wafer18 Aug 2026US 12,713,861 B2Disco Corporation
- Method of wafer dicing and manufacturing method of semiconductor devices using the same28 Jul 2026US 12,696,705 B2Samsung Electronics Co., Ltd.
- Chip manufacturing method using a laser beam with first and second focused points7 Apr 2026US 12,598,936 B2Disco Corporation
- Stock roll for protective film transfer, protective film arranging method, and chip manufacturing method1 Oct 2026US 2026/0305212 A1Disco Corporation
- Method for manufacturing group 3 nitride semiconductor template with improved bonding layer quality27 Aug 2026US 2026/0255934 A1Wavelord Co., Ltd
- Method for producing semiconductor substrate, semiconductor substrate, and semiconductor device20 Aug 2026US 2026/0247893 A1Shin-Etsu Handotai Co., Ltd.
- Method for packaging radio frequency identification (rfid) chip20 Aug 2026US 2026/0247895 A1Sichuan Kiloway Technologies Co., Ltd.
- Method for cleaning semiconductor chip and method for manufacturing semiconductor device20 Aug 2026US 2026/0247896 A1
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.