Stock roll for protective film transfer, protective film arranging method, and chip manufacturing method
AssigneeDisco Corporation
InventorsTomohiro Kaneko, Masamitsu Kimura, Shingo Motoike
Life of this patent
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Abstract
Provided is a stock roll for protective film transfer configured by a layered structure being wound, the layered structure including a sheet and a protective film applied to one surface of the sheet, in which the protective film is formed into a semi-cured state in which the protective film can be transferred to an object to be processed.
Claims10
A stock roll for protective film transfer configured by a layered structure being wound, the layered structure including a sheet and a protective film applied to one surface of the sheet, wherein
- the protective film is formed into a semi-cured state in which the protective film is able to be transferred to an object to be processed.
A protective film arranging method of arranging a protective film on an object to be processed, comprising:
- applying a protective film forming agent in liquid form to one surface of a sheet;
- forming the protective film forming agent applied to the one surface of the sheet into a protective film in a semi-cured state;
- and
- transferring the protective film to the object to be processed, from the sheet.
A chip manufacturing method of manufacturing a plurality of chips by dividing a workpiece on which a plurality of devices are formed, along boundaries of the plurality of devices, comprising:
- applying a protective film forming agent in liquid form to one surface of a sheet;
- forming the protective film forming agent applied to the one surface of the sheet into a protective film in a semi-cured state;
- transferring the protective film to the workpiece from the sheet;
- and
- dividing the workpiece into the plurality of chips by processing the workpiece from a side where the protective film is arranged, along the boundaries of the plurality of devices.
Dependencies are inferred from the claim text.