H10P 54/40
Cutting or separating of wafers, substrates or parts of devices: by sawing
Official title: by sawing, e.g. using revolving or reciprocating blades
H10P54/40 (Cutting or separating of wafers, substrates or parts of devices: by sawing) appears on 6 US grants and 22 published applications in this corpus.
Search patents in H10P- Granted patents
- 6
- Published applications
- 22
- Assignees
- 17
- Inventors
- 52
- Latest grant
- 26 Mar 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 2 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 1 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 2 |
| 2023 | 0 | 0 |
| 2024 | 1 | 2 |
| 2025 | 0 | 0 |
| 2026 | 0 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Singulation of silicon carbide semiconductor wafers26 Mar 2024US 11,942,327 B2Semiconductor Components Industries, LLC
- Singulation of silicon carbide semiconductor wafers19 Apr 2022US 11,309,188 B2Semiconductor Components Industries, LLC
- Removable temporary protective layers for use in semiconductor manufacturing30 Apr 2019US 10,276,440 B2Honeywell International Inc.
- Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method21 Dec 2010US 7,855,129 B2Sumco Corporation
- Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method24 Aug 2010US 7,781,309 B2Sumco Corporation
- Stock roll for protective film transfer, protective film arranging method, and chip manufacturing method1 Oct 2026US 2026/0305212 A1Disco Corporation
- Method for dicing semiconductor wafer and method for manufacturing semiconductor device1 Oct 2026US 2026/0305215 A1Resonac Corporation
- Method for cleaning semiconductor chip, and method for manufacturing semiconductor device1 Oct 2026US 2026/0305220 A1
- Stacked die memory sparing device and method17 Sep 2026US 2026/0282847 A1Micron Technology, Inc.
- Power Semiconductor Apparatus and Bonding Method Thereof27 Aug 2026US 2026/0255904 A1Diodes Incorporated
Most cited
By later US patents
- Precision dicing of silicon chips from a wafer43US 5,521,125 AXerox Corporation · 1996
- Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method26US 7,781,309 B2Sumco Corporation · 2010
- Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method3US 7,855,129 B2Sumco Corporation · 2010