Precision dicing of silicon chips from a wafer
AssigneeXerox Corporation
InventorsBrian T. Ormond, Josef E. Jedlicka
Life of this patent
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Abstract
A wafer design and dicing technique for creating semiconductor chips from wafers. A succession of oxide layers are deposited in first and second regions of a surface of a silicon substrate. The regions are separated by a street having no oxide layers therein, and the successive oxide layers form a vertical wall with a surface normal to the surface of the silicon substrate. A shock-absorbent material is deposited in the street, forming a concave meniscus therein. The shock-absorbent material retards the trajectories of silicon particles set into motion when the wafer is diced into chips.
Claims5
A method of making silicon chips, comprising the steps of:
- providing a silicon substrate defining a surface;
- depositing a first layer of oxide on a first region and a second region of a surface of the silicon substrate, the first region and second region being separated by a street having no oxide from the first layer of oxide therein;
- depositing a second layer of oxide on the first region and the second region of the surface of the silicon substrate, the second layer of oxide and the first layer of oxide sharing a common border in each of the first region and the second region along the street, wherein the first and second layers in each region form along a common border thereof a wall having a surface substantially normal to the surface of the silicon substrate;
- depositing shock-absorbent material in the street, the shock-absorbent material forming a concave meniscus in the street, the concave meniscus extending from a top of a layer of oxide in the first region to a top of a layer of oxide in the second region, wherein the shock-absorbent material directly contacts to the surface of the silicon substrate;
- and then
- sawing the silicon substrate along the street.
Dependencies are inferred from the claim text.