Discrete polymer in fan-out packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Jie Chen
Life of this patent
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Abstract
A package includes a first molding material, a lower-level device die in the first molding material, a dielectric layer over the lower-level device die and the first molding material, and a plurality of redistribution lines extending into the first dielectric layer to electrically couple to the lower-level device die. The package further includes an upper-level device die over the dielectric layer, and a second molding material molding the upper-level device die therein. A bottom surface of a portion of the second molding material contacts a top surface of the first molding material.
Claims20
A package comprising:
- a first molding material;
- a lower-level device die in the first molding material;
- a first dielectric layer over the lower-level device die and the first molding material;
- a plurality of redistribution lines extending into the first dielectric layer to electrically couple to the lower-level device die;
- an upper-level device die over the first dielectric layer;
- a second molding material molding the upper-level device die therein, wherein a bottom surface of a portion of the second molding material contacts a top surface of the first molding material;
- and
- a second dielectric layer over and in contact with both the upper-level device die and the second molding material.
A package comprising:
- a first molding material;
- a lower-level device die in the first molding material;
- a first polymer layer over the lower-level device die and the first molding material;
- a first plurality of redistribution lines extending into the first polymer layer to electrically couple to the lower-level device die;
- an upper-level device die over the first polymer layer;
- a second molding material molding the upper-level device die therein, wherein a first edge of the first molding material and a second edge of the second molding material are in a same plane to form an edge of the package, and wherein a portion of the second molding material comprises the second edge and a third edge opposite to each other, with the third edge contacting the first polymer layer, and the portion of the second molding material forms a full ring encircling, and contacting respective edges of, the first polymer layer;
- and
- a through-via in the second molding material, wherein the through-via and one of the first plurality of redistribution lines electrically couple the lower-level device die to the upper-level device die.
A package comprising:
- a first encapsulating material;
- a lower-level device die encapsulated in the first encapsulating material;
- a first plurality of dielectric layers over the lower-level device die and the first encapsulating material, wherein first plurality of dielectric layers extends laterally beyond edges of the lower-level device die;
- an upper-level device die over the first plurality of dielectric layers;
- a second encapsulating material encapsulating the upper-level device die therein, wherein a bottom surface of a portion of the second encapsulating material contacts a top surface of the first encapsulating material, and inner edges of the second encapsulating material contact outer edges of the first plurality of dielectric layers;
- a second plurality of dielectric layers over the upper-level device die and the second encapsulating material, wherein the second plurality of dielectric layers extends laterally beyond edges of the upper-level device die;
- and
- a third encapsulating material over the second encapsulating material, wherein a portion of the third encapsulating material is at a same level as, and contacting the edges of, the second plurality of dielectric layers.
Dependencies are inferred from the claim text.