Packaged semiconductor device with a molding compound and a method of forming the same

A packaged semiconductor device, comprising:

• a contact pad on a semiconductor die;
• an insulating layer surrounding sidewalls of the contact pad;
• a protective layer, wherein the protective layer is between the sidewalls of the contact pad and the insulating layer;
• and
• a molding compound surrounding the insulating layer, wherein the molding compound comes in contact with two adjacent and non-linear surfaces of the insulating layer, and the insulating layer separates the molding compound from an entirety of the semiconductor die.

A packaged semiconductor device, comprising:

• a contact pad on a semiconductor die;
• an insulating layer surrounding the contact pad;
• and
• a molding compound surrounding the insulating layer, wherein the molding compound is separated from the contact pad, and the molding compound contacts a first surface of the insulating layer, a second surface of the insulating layer, and a third surface of the insulating layer, and the first surface is not parallel with the second surface, the third surface is substantially parallel to the first surface, and the second surface is between the third surface and the first surface.