H10P 70/00
Cleaning of wafers, substrates or parts of devices
H10P70/00 (Cleaning of wafers, substrates or parts of devices) appears on 7,863 US grants and 9,273 published applications in this corpus.
Search patents in H10P- Granted patents
- 7,863
- Published applications
- 9,273
- Assignees
- 1,319
- Inventors
- 15,160
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 5 | 0 |
| 1978 | 3 | 0 |
| 1979 | 4 | 0 |
| 1980 | 6 | 0 |
| 1981 | 10 | 0 |
| 1982 | 6 | 0 |
| 1983 | 6 | 0 |
| 1984 | 3 | 0 |
| 1985 | 7 | 0 |
| 1986 | 5 | 0 |
| 1987 | 8 | 0 |
| 1988 | 6 | 0 |
| 1989 | 11 | 0 |
| 1990 | 14 | 0 |
| 1991 | 21 | 0 |
| 1992 | 28 | 0 |
| 1993 | 43 | 0 |
| 1994 | 59 | 0 |
| 1995 | 55 | 0 |
| 1996 | 53 | 0 |
| 1997 | 77 | 0 |
| 1998 | 111 | 0 |
| 1999 | 158 | 0 |
| 2000 | 180 | 0 |
| 2001 | 221 | 93 |
| 2002 | 230 | 255 |
| 2003 | 230 | 264 |
| 2004 | 201 | 351 |
| 2005 | 193 | 328 |
| 2006 | 181 | 407 |
| 2007 | 186 | 375 |
| 2008 | 170 | 371 |
| 2009 | 173 | 296 |
| 2010 | 232 | 269 |
| 2011 | 209 | 224 |
| 2012 | 211 | 293 |
| 2013 | 226 | 308 |
| 2014 | 239 | 350 |
| 2015 | 279 | 416 |
| 2016 | 332 | 438 |
| 2017 | 359 | 441 |
| 2018 | 351 | 464 |
| 2019 | 372 | 465 |
| 2020 | 424 | 488 |
| 2021 | 401 | 439 |
| 2022 | 326 | 473 |
| 2023 | 335 | 447 |
| 2024 | 338 | 415 |
| 2025 | 335 | 370 |
| 2026 | 227 | 233 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10P 70/20Cleaning during device manufacture5,360
- H10P 70/10Cleaning before device manufacture, i.e. begin-of-line process2,196
- H10P 70/50Cleaning of wafers, substrates or parts of devices: characterised by the part522
- H10P 70/80Cleaning only by supercritical fluids219
- H10P 70/30Cleaning after the substrates have been singulated151
- H10P 70/60Cleaning only by mechanical processes100
- H10P 70/40Cleaning for reclaiming66
- H10P 70/70Cleaning only by lasers processes20
Recent patents
- Composition and method for treating substrate6 Oct 2026US 12,753,342 B2FUJIFILM Corporation
- Cleaning solution, method for cleaning substrate, and method for manufacturing semiconductor6 Oct 2026US 12,753,366 B2Tokyo Ohka Kogyo.Co., Ltd.
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- Dry-type cleansing apparatus for wafers6 Oct 2026US 12,757,664 B2Semes Co., Ltd.
- Semiconductor processing preclean methods and apparatus6 Oct 2026US 12,757,665 B2ASM IP Holding B. V.
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0307120 A1Tokyo Electron Limited
- Multi-gate device fabrication and structures thereof8 Oct 2026US 2026/0313936 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Doping profile for strained source/drain region8 Oct 2026US 2026/0313975 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Sic wafer and sic epitaxial wafer8 Oct 2026US 2026/0313999 A1Resonac Corporation
- Method for forming source/drain contacts8 Oct 2026US 2026/0314054 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for forming a thin layer on a semiconductor substrate and apparatus therefor628US 5,178,682 AMitsubishi Denki Kabushiki Kaisha · 1993
- Plasma treatment method and apparatus581US 5,242,539 AHitachi, Ltd. · 1993
- Selective formation of metallic films on metallic surfaces573US 8,956,971 B2ASM International N.V. · 2015
- Methods and apparatus for passivating a substrate in a plasma reactor567US 5,968,275 ALam Research Corporation · 1999
- Apparatus for efficient removal of halogen residues from etched substrates558US 8,293,016 B2APPLIED Materials.Inc. · 2012