Cleaning solution, method for cleaning substrate, and method for manufacturing semiconductor
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsMoe Nishijima, Kohei Serizawa, Emi Uchida
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Abstract
A cleaning solution, a method for cleaning a substrate, and a method for manufacturing a semiconductor. The cleaning solution includes at least one of a compound a1 represented by a general formula (a1), a salt of the compound (a1), a hydrate of the compound (a1), hydrogen iodide, borane, and a complex of the borane; an amine compound that has 4 or more carbon atoms and is not the compound a1, or a salt thereof; and an anticorrosive agent, in which R1 and R2 each independently represents an organic group that does not contain a carbonyl group, or a hydrogen atom.
Claims13
A cleaning solution, comprising:
- at least one compound (A) selected from the group consisting of a compound a1 represented by a general formula (a1), a salt of the compound a1, a hydrate of the compound a1, hydrogen iodide, borane, and a complex of the borane;
- an amine compound comprising 4 or more carbon atoms that is not the compound a1, or a salt thereof (B);
- and
- an anticorrosive agent (C),
- wherein the cleaning solution does not comprise an alkylamine comprising 1 to 3 carbon atoms, a hydroxylamine, tris(2-hydroxyethyl)methylammonium hydroxide (THEMAH), cetyl trimethylammonium hydroxide (CTAH), or choline,
- wherein R1 and R2 each independently represents an organic group that does not comprise a carbonyl group, or a hydrogen atom.
Dependencies are inferred from the claim text.