H10P 70/30
Cleaning after the substrates have been singulated
Official title: {Cleaning after the substrates have been singulated}
H10P70/30 (Cleaning after the substrates have been singulated) appears on 151 US grants and 207 published applications in this corpus.
Search patents in H10P- Granted patents
- 151
- Published applications
- 207
- Assignees
- 79
- Inventors
- 412
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 3 |
| 2007 | 0 | 3 |
| 2008 | 1 | 2 |
| 2009 | 2 | 5 |
| 2010 | 3 | 1 |
| 2011 | 1 | 4 |
| 2012 | 1 | 5 |
| 2013 | 5 | 5 |
| 2014 | 8 | 18 |
| 2015 | 12 | 16 |
| 2016 | 14 | 10 |
| 2017 | 17 | 19 |
| 2018 | 7 | 14 |
| 2019 | 10 | 14 |
| 2020 | 12 | 11 |
| 2021 | 12 | 12 |
| 2022 | 6 | 11 |
| 2023 | 13 | 14 |
| 2024 | 6 | 14 |
| 2025 | 11 | 15 |
| 2026 | 6 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding surface validation on dicing tape11 Aug 2026US 12,707,941 B2Adeia Semiconductor Bonding Technologies Inc.
- Post-plasma clean infrared image inspection for oxideless bonding and apparatus for effecting the same2 Jun 2026US 12,646,160 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Chip bonding method28 Apr 2026US 12,615,999 B2Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Device wafer processing method31 Mar 2026US 12,593,638 B2Disco Corporation
- Workpiece cutting method and resin applying device6 Jan 2026US 12,519,018 B2Hamamatsu Photonics K.K.
- Base film agent and processing method for workpiece8 Oct 2026US 2026/0314287 A1Disco Corporation
- Method for cleaning semiconductor chip, and method for manufacturing semiconductor device1 Oct 2026US 2026/0305220 A1
- Wafer processing method24 Sep 2026US 2026/0293566 A1Disco Corporation
- Post-plasma clean infrared image inspection for oxideless bonding and apparatus for effecting the same17 Sep 2026US 2026/0278765 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing substrate laminate3 Sep 2026US 2026/0262539 A1Mitsui Chemicals, Inc.
Most cited
By later US patents
- Method of reducing residual contamination in singulated semiconductor die237US 10,026,605 B2Semiconductor Components Industries, LLC · 2018
- Processed stacked dies172US 10,879,212 B2Invensas Bonding Technologies, Inc. · 2020
- Residue removal from singulated die sidewall36US 9,076,860 B1APPLIED Materials.Inc. · 2015
- Ultrasonic cleaning system and method24US 10,018,113 B2General Electric Company · 2018
- Method of manufacturing a semiconductor device23US 7,033,857 B2Renesas Northern Japan Semiconductor, Inc. · 2006