Processed stacked dies
AssigneeInvensas Bonding Technologies, Inc.
InventorsCyprian Emeka Uzoh, Guilian Gao, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr.
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Abstract
Representative implementations of techniques and methods include processing singulated dies in preparation for bonding. A plurality of semiconductor die components may be singulated from a wafer component, the semiconductor die components each having a substantially planar surface. Particles and shards of material may be removed from edges of the plurality of semiconductor die component. Additionally, one or more of the plurality of semiconductor die components may be bonded to a prepared bonding surface, via the substantially planar surface.
Claims21
A method for forming a microelectronic system, comprising:
- singulating a plurality of semiconductor die components from a wafer component, the semiconductor die components each having a substantially planar surface;
- removing particles and shards of material from edges of the plurality of semiconductor die components;
- etching the substantially planar surface of the plurality of semiconductor die components to a preselected depth or for a preselected duration;
- and
- bonding one or more of the plurality of semiconductor die components to a prepared bonding surface, via the substantially planar surface.
A method for forming a microelectronic system, comprising:
- singulating a plurality of semiconductor die components from a wafer component, the semiconductor die components each comprising a dielectric layer over a base semiconductor layer and having a substantially planar surface;
- etching the periphery of the plurality of semiconductor die components to a preselected depth or for a preselected duration, including removing at least a portion of the dielectric layer at the periphery of the plurality of semiconductor die components;
- and
- bonding one or more of the plurality of semiconductor die components to a prepared bonding surface, via the substantially planar surface.
Dependencies are inferred from the claim text.