Wafer processing method

Abstract

The present disclosure provides a wafer processing method with which swarf do not remain in the division groove. The wafer processing method includes: forming half-cut grooves on a front face of the wafer correspondingly with chips to be formed; disposing a protective member on a front face of the wafer on which the half-cut grooves are formed; dividing the wafer into individual chips by grinding a back surface side of the wafer to expose the half-cut grooves on the back surface side of the wafer so as to form division grooves; and cleaning the wafer on which the division grooves are formed. In the cleaning, cleaning water, of which resistivity has been lowered by supplying gas, is infiltrated into the division grooves, so as to remove swarf from the division grooves.

Dependencies are inferred from the claim text.