Workpiece cutting method and resin applying device

A workpiece cutting method comprising:

• a first step of pasting an expandable sheet on a front surface or a back surface of a workpiece;
• a second step of irradiating, after the first step, the workpiece with laser light along a line to cut to form a modified region and expanding the expandable sheet to divide at least a part of the workpiece into a plurality of chips, and meanwhile, to form a gap disposed between the plurality of chips and extending to a side surface of the workpiece;
• a third step of irradiating the expandable sheet with ultraviolet light after the first step;
• a fourth step of filling, after the second step and the third step, the gap with resin from an outer edge part of the workpiece including the side surface;
• a fifth step of curing the resin after the fourth step;
• and
• a sixth step of taking out the plurality of chips from above the expandable sheet after the fifth step, wherein
• in the fourth step,
• the gap is filled with the resin in a state where the workpiece is placed on a table, and
• the table is inclined to make a position where the resin is applied on the table be higher than the workpiece.

A workpiece cutting method comprising:

• a first step of pasting an expandable sheet on a front surface or a back surface of a workpiece;
• a second step of irradiating, after the first step, the workpiece with laser light along a line to cut to form a modified region and expanding the expandable sheet to divide at least a part of the workpiece into a plurality of chips, and meanwhile, to form a gap disposed between the plurality of chips and extending to a side surface of the workpiece;
• a third step of irradiating the expandable sheet with ultraviolet light after the first step;
• a fourth step of filling, after the second step and the third step, the gap with resin from an outer edge part of the workpiece including the side surface;
• a fifth step of curing the resin after the fourth step;
• and
• a sixth step of taking out the plurality of chips from above the expandable sheet after the fifth step, wherein, in the fifth step, the resin filled in the gap of the workpiece is cured in a state where the workpiece is placed on a table and by irradiating the resin with the ultraviolet light from below.