Bonding surface validation on dicing tape
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsCyprian Emeka Uzoh, Oliver Zhao
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Abstract
The disclosed technology relates to methods for forming and/or validating bonding surfaces of integrated device dies mounted on a dicing tape, and dicing tapes used thereof. In some embodiments, such a method for forming and validating a microelectronic assembly may include mounting a substrate to a dicing tape; singulating the substrate while the substrate is mounted to the dicing tape to form a plurality of dies; and validating a bonding surface of at least one die of the plurality of dies while the at least one die is mounted to the dicing tape. In some embodiments, such a dicing tape may include an anti-static adhesive layer arranged on an anti-static base film.
Claims19
A method of forming a microelectronic assembly, comprising:
- mounting a substrate to an anti-static dicing tape, the anti-static dicing tape comprising an anti-static adhesive layer;
- and
- singulating through the substrate and partially through the anti-static adhesive layer to form a plurality of dies.
A method of forming a microelectronic assembly, comprising:
- mounting a substrate to an anti-static dicing tape, the anti-static dicing tape comprising an anti-static adhesive layer;
- singulating through the substrate and partially through the anti-static adhesive layer to form a plurality of dies;
- and
- validating a bonding surface of at least one die of the plurality of dies while the at least one die is mounted to the anti-static dicing tape.
A method of forming a microelectronic assembly, comprising:
- mounting a substrate to an anti-static dicing tape, the anti-static dicing tape comprising an anti-static adhesive layer;
- singulating through the substrate and partially through the anti-static adhesive layer to form a plurality of dies, wherein singulating through the substrate comprises partially dicing through a conductive region of the anti-static dicing tape.
Dependencies are inferred from the claim text.