Device wafer processing method

A device wafer processing method that divides a device wafer having devices formed on a face side thereof by a device layer laminated on a wafer, along a plurality of streets that demarcate the devices, the processing method comprising:

• a protective film coating step of coating the face side of the device wafer with a protective film, wherein the protective film has a front surface and a back surface, the back surface being on the face side of the device wafer;
• a laser processing step of applying, along the streets, a laser beam having a wavelength absorbable by the device wafer to the device wafer and forming laser processing grooves that divide the device layer, after the protective film coating step is carried out;
• a tape affixing step of affixing a tape to the front surface of the protective film on the device wafer, after the laser processing step is carried out;
• a holding step of holding the face side of the device wafer by a holding table via the tape and exposing a reverse side of the device wafer, after the tape affixing step is carried out;
• and
• a cutting step of cutting the device wafer held on the holding table, by a cutting blade from the reverse side along the streets, and dividing the device wafer into individual devices, after the holding step is carried out.