H10P 70/70
Cleaning only by lasers processes
Official title: {Cleaning only by lasers processes, e.g. laser ablation}
H10P70/70 (Cleaning only by lasers processes) appears on 20 US grants and 31 published applications in this corpus.
Search patents in H10P- Granted patents
- 20
- Published applications
- 31
- Assignees
- 18
- Inventors
- 98
- Latest grant
- 18 Mar 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 1 |
| 2012 | 1 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 2 | 4 |
| 2018 | 1 | 1 |
| 2019 | 1 | 2 |
| 2020 | 1 | 5 |
| 2021 | 3 | 6 |
| 2022 | 2 | 0 |
| 2023 | 3 | 2 |
| 2024 | 2 | 3 |
| 2025 | 1 | 3 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Substrate processing system and substrate processing method18 Mar 2025US 12,255,063 B2Tokyo Electron Limited
- Method and apparatus for treating substrate30 Apr 2024US 11,972,939 B2Semes Co., Ltd.
- Apparatus and system for treating substrate9 Jan 2024US 11,869,763 B2Semes Co., Ltd.
- Subnanometer-level light-based substrate cleaning mechanism28 Nov 2023US 11,830,726 B2Planar Semiconductor Corporation Pte. Ltd.
- Dry cleaning apparatus and dry cleaning method29 Aug 2023US 11,742,221 B2Samsung Electronics Co., Ltd.
- Substrate processing method and substrate processing apparatus17 Sep 2026US 2026/0282843 A1Tokyo Electron Limited
- Substrate processing system and substrate processing method12 Jun 2025US 2025/0191905 A1Tokyo Electron Limited
- High-aspect-ratio vertical interconnects for high-frequency applications12 Jun 2025US 2025/0192077 A1Ciena Corporation
- Method and System for Torsional Optical Manipulation to Remove Particles from Semiconductor Surfaces8 May 2025US 2025/0149326 A1
- Processing method and processing system5 Dec 2024US 2024/0404852 A1Tokyo Electron Limited
Most cited
By later US patents
- Method and apparatus for local vectorial particle cleaning13US 6,566,169 B1Oramir Semiconductor Equipment Ltd. · 2003
- Semiconductor package with electromagnetic interference shielding4US 10,461,007 B2Intel Corporation · 2019
- De-bonding and cleaning process and system3US 9,895,871 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate2US 11,373,863 B2Infineon Technologies AG · 2022
- Method of clearing electrical contact pads in thin film sealed OLED devices2US 7,745,340 B2eMagin Corporation · 2010