Apparatus and system for treating substrate

An apparatus for treating a substrate, the apparatus comprising:

• a chamber defining an inner space;
• a pedestal received in the inner space and configured to support the substrate;
• a first laser irradiation unit configured to perform an edge bead removal (EBR) process by firing a first laser beam having a first wavelength to remove an exposed upper first layer of an organic film on an upper surface of the substrate that is supported on the pedestal;
• and
• a second laser irradiation unit configured to perform the EBR process by firing a second laser beam having a second wavelength, different than the first wavelength, to remove a second layer of the organic film on the upper surface of the substrate that is supported on the pedestal,
• wherein the first wavelength and the second wavelength are selected from among four wavelength ranges, a wavelength range of the first wavelength different from a wavelength range of the second wavelength, and
• the four wavelength ranges include a first range of 750 nm to 1200 nm, a second range of 380 nm to 749 nm, a third range of 300 nm to 379 nm, and a fourth range of 150 nm to 299 nm.