Semiconductor package with electromagnetic interference shielding

A microelectronics package, comprising:

• a substrate having a top substrate surface and a substrate outer periphery, the top substrate surface having an electronic component mounted thereon and the top substrate surface having a conductive trace along at least a portion of the substrate outer periphery;
• a molding compound provided over the top substrate surface, having a bottom molding surface, a top molding surface, and a molding sidewall substantially overlying the substrate outer periphery;
• a metallic sheet provided over the top molding surface;
• and
• epoxy provided on the molding sidewall, wherein the epoxy includes conductive particles, and wherein the epoxy is electrically coupled to the metallic sheet, wherein the electronic component is a first electronic component, and wherein the microelectronics package further comprises:
• a second electronic component;
• and
• a conductive structure electrically connected to the conductive trace and the
• metallic sheet, and disposed between the first electronic component and the second electronic component in a trench formed in the molding extending from the bottom molding surface to the top molding surface.