Substrate processing system and substrate processing method

A substrate processing system configured to process a substrate, comprising:

• a first modifying apparatus configured to form, within a combined substrate, an internal modification layer by radiating laser light, wherein the combined substrate is formed by bonding a front surface of a first substrate and a front surface of a second substrate with a device layer therebetween, and the internal modification layer is elongated within the first substrate in a plane direction from a center of the first substrate toward at least an edge portion of the first substrate as a removing target;
• a second modifying apparatus configured to form, within the first substrate, an edge modification layer by radiating laser light, wherein the edge modification layer is elongated in a thickness direction of the first substrate along a boundary between the edge portion and a central portion of the first substrate;
• a separating apparatus configured to separate a portion of the first substrate at a rear surface side, starting from the internal modification layer;
• and
• a third modifying apparatus configured to form a non-bonding region, which reduces a bonding force between the first substrate and the second substrate, by radiating laser light at an interface between the first substrate and the second substrate.