De-bonding and cleaning process and system

A method comprising:

• providing a package substrate bonded to a carrier substrate by a release coating, the release coating being on a surface of the package substrate;
• placing the package substrate on a tape, the package substrate being interposed between the carrier substrate and the tape;
• separating the carrier substrate from the package substrate;
• and
• after separating the carrier substrate from the package substrate, cleaning the surface of the package substrate in a cleaning module, the tape being held by a frame and a cover ring, the cover ring being over a portion of the tape adjacent the package substrate, and the cover ring extending over at least a portion of an upper surface of the frame;
• wherein the cleaning includes supplying a fluid to the surface of the package substrate and contacting the surface of the package substrate with a cleaning mechanism to remove residue from the surface of the package substrate.

A semiconductor processing tool comprising:

• a cleaning module comprising:
• a first chuck,
• a frame attached to the first chuck, and
• a cover ring attached to the frame, the cover ring being configured to encircle a substrate on the first chuck and to cover at least a portion of the first chuck and to cover an upper surface of the frame;
• and
• a carrier recycle module.