Substrate processing method and substrate processing apparatus

A substrate processing method, comprising:

• preparing a substrate having a first main surface and a second main surface opposite to the first main surface, each of the first main surface and the second main surface having waviness;
• acquiring map data of the waviness of the first main surface before laser processing;
• outputting, by a computer, map data of a processing amount in a current laser processing by inputting the map data of the waviness of the first main surface acquired before the current laser processing into a model trained by machine learning using, as training data, required data of the substrate previously subjected to the laser processing of the first main surface, grinding or polishing processing of the second main surface, and grinding or polishing processing of the first main surface;
• performing the laser processing of the first main surface;
• then
• performing the grinding or polishing processing of the second main surface;
• and then
• performing the grinding or polishing processing of the first main surface,
• wherein the required data includes map data of the waviness of the first main surface acquired before the laser processing, and map data of a processing amount in the laser processing, and map data of the waviness of the first main surface acquired after the grinding or polishing processing of the second main surface and the grinding or polishing processing of the first main surface.

A substrate processing apparatus, comprising:

• a transfer device including a transfer arm, the transfer device being for transferring a substrate having a first main surface and a second main surface opposite to the first main surface, each of the first main surface and the second main surface having waviness;
• a laser processing device for performing laser processing of the first main surface before performing a grinding or polishing processing of the second main surface and the first main surface;
• and
• a control circuit configured to control the laser processing device,
• wherein the control circuit performs:
• acquiring map data of the waviness of the first main surface before the laser processing;
• and
• setting a processing condition for a current laser processing based on, in addition to the map data of the waviness of the first main surface acquired before the current laser processing, required data of the substrate previously subjected to the laser processing of the first main surface, the grinding or polishing processing of the second main surface, and the grinding or polishing processing of the first main surface in this order.

A substrate processing apparatus, comprising:

• a transfer device including a transfer arm, the transfer device being for transferring a substrate having a first main surface and a second main surface opposite to the first main surface, each of the first main surface and the second main surface having waviness;
• a laser processing device for performing a laser processing of the first main surface before performing a grinding or polishing processing of the second main surface and the first main surface;
• and
• a control circuit configured to control the laser processing device,
• wherein the control circuit performs:
• acquiring map data of the waviness of the first main surface before the laser processing;
• and
• outputting map data of a processing amount in a current laser processing by inputting the map data of the waviness of the first main surface acquired before the current laser processing into a model trained by machine learning using, as training data, required data of the substrate previously subjected to the laser processing of the first main surface, the grinding or polishing processing of the second main surface, and the grinding or polishing processing of the first main surface in this order,
• the required data includes map data of the waviness of the first main surface acquired before the laser processing, and map data of a processing amount in the laser processing, and map data of the waviness of the first main surface acquired after the grinding or polishing processing.