H10P 70/80
Cleaning only by supercritical fluids
Official title: {Cleaning only by supercritical fluids}
H10P70/80 (Cleaning only by supercritical fluids) appears on 219 US grants and 340 published applications in this corpus.
Search patents in H10P- Granted patents
- 219
- Published applications
- 340
- Assignees
- 76
- Inventors
- 546
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 2 |
| 2004 | 3 | 10 |
| 2005 | 6 | 13 |
| 2006 | 4 | 18 |
| 2007 | 4 | 16 |
| 2008 | 8 | 6 |
| 2009 | 3 | 4 |
| 2010 | 3 | 4 |
| 2011 | 4 | 4 |
| 2012 | 2 | 11 |
| 2013 | 6 | 6 |
| 2014 | 4 | 6 |
| 2015 | 4 | 12 |
| 2016 | 7 | 6 |
| 2017 | 7 | 19 |
| 2018 | 10 | 30 |
| 2019 | 14 | 23 |
| 2020 | 20 | 26 |
| 2021 | 17 | 16 |
| 2022 | 23 | 24 |
| 2023 | 8 | 19 |
| 2024 | 24 | 22 |
| 2025 | 19 | 34 |
| 2026 | 17 | 8 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Mitigation of capillary pattern collapse in supercritical dry6 Oct 2026US 12,757,666 B2Tokyo Electron Limited
- Substrate processing apparatus and substrate processing method15 Sep 2026US 12,740,362 B2Tokyo Electron Limited
- Substrate processing apparatus and substrate processing method25 Aug 2026US 12,721,083 B2Tokyo Electron Limited
- Substrate processing method and substrate processing apparatus25 Aug 2026US 12,721,084 B2Tokyo Electron Limited
- Apparatus and method for processing substrate using supercritical fluid11 Aug 2026US 12,707,913 B2Semes Co., Ltd.
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0307120 A1Tokyo Electron Limited
- Mitigation of Capillary Pattern Collapse in Supercritical Dry30 Jul 2026US 2026/0223620 A1Tokyo Electron Limited
- Substrate processing system, interface apparatus, and substrate processing method7 May 2026US 2026/0130265 A1Tokyo Electron Limited
- Substrate processing method using low temperature developer and semiconductor device manufacturing apparatus using the same30 Apr 2026US 2026/0118770 A1Samsung Electronics Co., Ltd.
- Substrate processing apparatus and substrate processing method2 Apr 2026US 2026/0096376 A1Tokyo Electron Limited
Most cited
By later US patents
- Supercritical compositions for removal of organic material and methods of using same116US 6,242,165 B1Micron Technology, Inc. · 2001
- Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials66US 6,764,552 B1Novellus Systems, Inc. · 2004
- Removal of photoresist and residue from substrate using supercritical carbon dioxide process54US 6,500,605 B1Tokyo Electron Limited · 2002
- Methods for transferring supercritical fluids in microelectronic and other industrial processes52US 6,905,555 B2Micell Technologies, Inc. · 2005
- Method of treating a semiconductor substrate41US 7,749,909 B2Kabushiki Kaisha Toshiba · 2010