Substrate processing apparatus and substrate processing method

A substrate processing method using a substrate processing apparatus,

• wherein the substrate processing apparatus includes:
• a processing container;
• a holder configured to hold a substrate in a horizontal orientation at a holding position inside the processing container;
• and
• a fluid supplier configured to supply a processing fluid into the processing container from a lateral side of the processing container,
• wherein, in a state in which the substrate is held by the holder, a first distance between a first virtual plane, including an upper surface of the substrate, and a ceiling surface of the processing container is different from a second distance between a second virtual plane, including a lower surface of the substrate, and a bottom surface of the processing container,
• wherein the fluid supplier includes a nozzle configured to change a flow of the processing fluid,
• wherein the nozzle includes:
• a first discharger configured to discharge a first discharge amount of the processing fluid from a position above the first virtual plane;
• and
• a second discharger configured to discharge a second discharge amount of the processing fluid from a position below the second virtual plane, and
• wherein the fluid supplier supplies the processing fluid into the processing container by changing the flow of the processing fluid using the nozzle so that a magnitude relationship between the first discharge amount and the second discharge amount corresponds to a magnitude relationship between the first distance and the second distance.