H10P 70/40
Cleaning for reclaiming
Official title: {Cleaning for reclaiming}
H10P70/40 (Cleaning for reclaiming) appears on 66 US grants and 91 published applications in this corpus.
Search patents in H10P- Granted patents
- 66
- Published applications
- 91
- Assignees
- 61
- Inventors
- 227
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 1 |
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 3 |
| 2006 | 2 | 6 |
| 2007 | 1 | 9 |
| 2008 | 3 | 11 |
| 2009 | 2 | 6 |
| 2010 | 9 | 5 |
| 2011 | 2 | 4 |
| 2012 | 2 | 0 |
| 2013 | 0 | 1 |
| 2014 | 4 | 1 |
| 2015 | 1 | 3 |
| 2016 | 4 | 3 |
| 2017 | 1 | 4 |
| 2018 | 3 | 5 |
| 2019 | 1 | 3 |
| 2020 | 6 | 4 |
| 2021 | 2 | 2 |
| 2022 | 2 | 4 |
| 2023 | 2 | 10 |
| 2024 | 2 | 2 |
| 2025 | 5 | 2 |
| 2026 | 5 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate processing system and substrate processing method21 Apr 2026US 12,610,770 B2SCREEN Holdings Co., Ltd.
- Composition, and method for cleaning adhesive polymer17 Mar 2026US 12,577,508 B2Resonac Corporation
- Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and stripping composition10 Feb 2026US 12,545,863 B2Nissan Chemical Corporation
- Fully automated wafer debonding system and method thereof3 Feb 2026US 12,543,526 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peeling27 Jan 2026US 12,534,693 B2Nissan Chemical Corporation
- Semiconductor device and manufacturing method of semiconductor device14 Aug 2025US 2025/0259877 A1Kioxia Corporation
- Conditioning semiconductor processing solutions for reuse2 Jan 2025US 2025/0004380 A1Intel Corporation
- Ultrasonic cleaning method15 Aug 2024US 2024/0269716 A1Yamaha Robotics Holdings Co., Ltd.
- Method for preparing semiconductor layer27 Jun 2024US 2024/0213021 A1National Taiwan University
- Fully automated wafer debonding system and method thereof7 Sep 2023US 2023/0282494 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for reclaiming substrate from semiconductor wafers46US 5,622,875 AKobe Precision Inc. · 1997
- Process for recovering substrates43US 5,855,735 AKobe Precision Inc. · 1999
- Use of chemical mechanical polishing and/or poly-vinyl-acetate scrubbing to restore quality of used semiconductor wafers39US 6,276,997 B12001
- Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon38US 7,960,328 B2Advanced Technology Materials, Inc. · 2011
- Process for reclaiming wafer substrates17US 6,406,923 B1Kabushiki Kaisha Kobe Seiko Sho · 2002