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US 6,406,923 B1Granted
Process for reclaiming wafer substrates
AssigneesKobe Precision Inc., Kabushiki Kaisha Kobe Seiko Sho
InventorsHidetoshi Inoue, Satoru Takada, Yoshihiro Hara
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Abstract
A process capable of reclaiming used semiconductor wafers with a reduced metallic contamination level on wafer surfaces. The process comprises the steps of removing one or more surface layers of the substrate by chemical etching; scraping off one surface of the substrate in small amount by mechanical machining; removing a damage layer, which has occurred due to the mechanical machining, by chemical etching; and polishing the other surface of the substrate into a mirror finish.
Claims7
A process for reclaiming a used wafer substrate, the process comprising the steps of:
- removing one or more surface layers of the substrate by chemical etching;
- blasting away from the substrate 0.1-5 μm of one surface of the substrate;
- removing a damage layer, which has occurred due to the blasting, by chemical etching;
- and
- polishing the other surface of the substrate into a mirror finish.
2 more elements
Dependencies are inferred from the claim text.