Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and stripping composition

A semiconductor substrate cleaning method comprising removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein

• the adhesive layer is a film formed from an adhesive composition comprising an adhesive component(S) containing a siloxane adhesive which comprises a polyorganosiloxane component (A) being curable through hydrosilylation;
• the polyorganosiloxane component (A) comprises a polysiloxane (A1) having one or more units selected from the group consisting of a siloxane unit represented by SiO2 (unit Q), a siloxane unit represented by R1R2R3SiO1/2 (unit M), a siloxane unit represented by R4R5SiO2/2 (unit D), and a siloxane unit represented by R6SiO3/2 (unit T), and a platinum group metal catalyst (A2);
• wherein the polysiloxane (A1) comprises a polyorganosiloxane (a1) having one or more units selected from the group consisting of a siloxane unit represented by SiO2 (unit Q′), a siloxane unit represented by R1′R2′R3′SiO1/2 (unit M′), a siloxane unit represented by R4′R5′SiO2/2 (unit D′), and a siloxane unit represented by R6′SiO3/2 (unit T′), and at least one unit selected from the group consisting of unit M′, unit D′, and unit T′, and a polyorganosiloxane (a2) having one or more units selected from the group consisting of a siloxane unit represented by SiO2 (unit Q″), a siloxane unit represented by R1″R2″R3″SiO1/2 (unit M″), a siloxane unit represented by R4″R5″SiO2/2 (unit D″), and a siloxane unit represented by R6″SiO3/2 (unit T″) and at least one unit selected from the group consisting of unit M″, unit D″, and unit T″;
• each of R1 to R6 is a group or an atom bonded to a silicon atom and represents an alkyl group, an alkenyl group, or a hydrogen atom, each of R1′ to R6′ is a group bonded to a silicon atom and represents an alkyl group or an alkenyl group, and at least one of R1′ to R6′ is an alkenyl group, each of R1″ to R6″ is a group or an atom bonded to a silicon atom and represents an alkyl group or a hydrogen atom, and at least one of R1″ to R6″ is a hydrogen atom;
• the remover composition contains a solvent but no salt;
• and
• the solvent includes an organic solvent represented by any of formulae (L0) to (L4):
• (wherein each of L101 to L112 independently represents a hydrogen atom, a C1 to C5 alkyl group, a C2 to C5 alkenyl group, or a C2 to C5 alkynyl group, and at least one of L101 to L112 represents a C1 to C5 alkyl group, a C2 to C5 alkenyl group, or a C2 to C5 alkynyl group;
• each of L201 to L210 independently represents a hydrogen atom, a C1 to C5 alkyl group, a C2 to C5 alkenyl group, or a C2 to C5 alkynyl group, and at least one of L201 to L210 represents a C1 to C5 alkyl group, a C2 to C5 alkenyl group, or a C2 to C5 alkynyl group;
• each of L301 to L308 independently represents a hydrogen atom, a C1 to C5 alkyl group, a C2 to C5 alkenyl group, or a C2 to C5 alkynyl group, and at least one of L301 to L308 represents a C1 to C5 alkyl group, a C2 to C5 alkenyl group, or a C2 to C5 alkynyl group;
• and each of L401 to L408 independently represents a hydrogen atom, a C1 to C5 alkyl group, a C2 to C5 alkenyl group, or a C2 to C5 alkynyl group, and at least one of L401 to L408 represents a C1 to C5 alkyl group, a C2 to C5 alkenyl group, or a C2 to C5 alkynyl group) in an amount of 80 mass % or more.