Fully automated wafer debonding system and method thereof

A method for debonding a pair of bonded wafers, the method comprising:

• attaching a pair of bonded wafers onto a wafer chuck;
• inserting a plurality of separating blades into a bonding interface between a first wafer and a second wafers of the pair of bonded wafer using a robotic arm, wherein the plurality of separating blades are substantially equally spaced from each other around the pair of bonded wafers;
• pulling the second wafer upwardly so as to debond the second wafer from the first wafer using at least one pulling head;
• and
• monitoring pressure applied to the first wafer and the second wafer during inserting the plurality of separating blades into the bonding interface.

A method for debonding a pair of bonded wafers, the method comprising:

• attaching a pair of bonded wafers to a top surface of a wafer chuck;
• arranging a plurality of separating blades that are substantially equally spaced from each other around the pair of bonded wafers;
• inserting the plurality of separating blades between a first wafer and a second wafer of the pair of bonded wafers;
• pulling the second wafer upwardly using at least one pulling head so as to debond the first wafer from the second wafer;
• monitor the pulling process using a camera of an automatic optical inspection (AOI) system;
• transmitting feedback signals to actuators controlling the plurality of separating blades and the at least one pulling head;
• and
• measuring, using the AOI system, an inserting speed, depth, and slope of the plurality of separating blades and feeding back, using the AOI system, the measured inserting speed, depth, and slope to a controller that is configured to control a rotating speed of the plurality of separating of blades.