Substrate processing system and substrate processing method

A substrate processing method comprising:

• a protective film forming liquid supplying step of holding a substrate by a holding unit and supplying a protective film forming liquid to one surface of the substrate from one side in an up/down direction thereof, the protective film forming liquid containing a solute and a solvent;
• a protective film forming step of holding the substrate by the holding unit and solidifying or hardening the protective film forming liquid on the one surface of the substrate to form a protective film on the one surface of the substrate by rotating the substrate in a manner effective to accelerate evaporation of the solvent from the protective film forming liquid on the one surface of the substrate;
• a first turning step of turning the substrate around, such that the one surface of the substrate faces the other side in the up/down direction after the protective film forming liquid supplying step,
• a cleaning step of executing predetermined cleaning with respect to an entire area of the other surface of the substrate while the one surface of the substrate on which the protective film has been formed is being suctioned by a suction unit;
• a second turning step of turning around the substrate such that the one surface of the substrate faces toward the one side in the up/down direction after the cleaning step;
• and
• a removing step of holding the substrate by the holding unit and supplying a removing liquid to the one surface of the substrate from a removing liquid discharge port after the cleaning step to remove the protective film from the one surface of the substrate.