H10P 70/10
Cleaning before device manufacture, i.e. begin-of-line process
Official title: {Cleaning before device manufacture, i.e. Begin-Of-Line process}
H10P70/10 (Cleaning before device manufacture, i.e. begin-of-line process) appears on 2,196 US grants and 2,062 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,196
- Published applications
- 2,062
- Assignees
- 676
- Inventors
- 5,026
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 4 | 0 |
| 1980 | 4 | 0 |
| 1981 | 7 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 6 | 0 |
| 1988 | 5 | 0 |
| 1989 | 10 | 0 |
| 1990 | 9 | 0 |
| 1991 | 18 | 0 |
| 1992 | 20 | 0 |
| 1993 | 31 | 0 |
| 1994 | 44 | 0 |
| 1995 | 32 | 0 |
| 1996 | 38 | 0 |
| 1997 | 43 | 0 |
| 1998 | 74 | 0 |
| 1999 | 95 | 0 |
| 2000 | 88 | 0 |
| 2001 | 105 | 41 |
| 2002 | 112 | 127 |
| 2003 | 104 | 105 |
| 2004 | 71 | 158 |
| 2005 | 80 | 131 |
| 2006 | 75 | 122 |
| 2007 | 68 | 81 |
| 2008 | 45 | 77 |
| 2009 | 48 | 51 |
| 2010 | 40 | 52 |
| 2011 | 41 | 43 |
| 2012 | 42 | 62 |
| 2013 | 40 | 57 |
| 2014 | 45 | 87 |
| 2015 | 58 | 63 |
| 2016 | 67 | 88 |
| 2017 | 59 | 93 |
| 2018 | 72 | 98 |
| 2019 | 67 | 93 |
| 2020 | 89 | 63 |
| 2021 | 68 | 74 |
| 2022 | 50 | 74 |
| 2023 | 50 | 76 |
| 2024 | 66 | 67 |
| 2025 | 45 | 45 |
| 2026 | 42 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Dry-type cleansing apparatus for wafers6 Oct 2026US 12,757,664 B2Semes Co., Ltd.
- Semiconductor processing preclean methods and apparatus6 Oct 2026US 12,757,665 B2ASM IP Holding B. V.
- Apparatus and method for dispensing treatment liquid29 Sep 2026US 12,751,239 B2Semes Co., Ltd.
- Method of cleaning silicon wafer, method of manufacturing silicon wafer, and silicon wafer22 Sep 2026US 12,745,582 B2Shin-Etsu Handotai Co., Ltd.
- Semiconductor devices and methods of manufacture22 Sep 2026US 12,745,583 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Sic wafer and sic epitaxial wafer8 Oct 2026US 2026/0313999 A1Resonac Corporation
- Apparatus and method for removal of oxide and carbon from semiconductor films in a single processing chamber8 Oct 2026US 2026/0314290 A1ASM IP Holding B. V.
- Method for cleaning semiconductor wafer1 Oct 2026US 2026/0305217 A1Sumco Corporation
- Substrate processing apparatus and substrate processing method24 Sep 2026US 2026/0293584 A1SCREEN Holdings Co., Ltd.
- Semiconductor processing preclean methods and apparatus17 Sep 2026US 2026/0282789 A1ASM IP Holding B. V.
Most cited
By later US patents
- Method for forming a thin layer on a semiconductor substrate and apparatus therefor628US 5,178,682 AMitsubishi Denki Kabushiki Kaisha · 1993
- Substrate processing method, substrate processing apparatus, and program storage medium523US 8,020,315 B2Tokyo Electron Limited · 2011
- Substrate processing method and substrate processing apparatus490US 6,620,251 B2Tokyo Electron Limited · 2003
- Plasma pre-clean module and process477US 9,299,557 B2ASM IP Holding B. V. · 2016
- Plasma pre-clean module and process474US 9,514,927 B2ASM IP Holding B. V. · 2016