H10P 70/18
By combined dry cleaning and wet cleaning
Official title: {by combined dry cleaning and wet cleaning (H10P70/52 takes precedence)}
H10P70/18 (By combined dry cleaning and wet cleaning) appears on 141 US grants and 125 published applications in this corpus.
Search patents in H10P- Granted patents
- 141
- Published applications
- 125
- Assignees
- 83
- Inventors
- 324
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 13 | 8 |
| 2002 | 9 | 13 |
| 2003 | 7 | 6 |
| 2004 | 7 | 9 |
| 2005 | 12 | 11 |
| 2006 | 2 | 4 |
| 2007 | 5 | 1 |
| 2008 | 2 | 4 |
| 2009 | 1 | 2 |
| 2010 | 1 | 4 |
| 2011 | 3 | 6 |
| 2012 | 2 | 1 |
| 2013 | 0 | 2 |
| 2014 | 2 | 7 |
| 2015 | 5 | 3 |
| 2016 | 4 | 3 |
| 2017 | 2 | 2 |
| 2018 | 2 | 5 |
| 2019 | 5 | 10 |
| 2020 | 4 | 2 |
| 2021 | 7 | 4 |
| 2022 | 5 | 3 |
| 2023 | 2 | 3 |
| 2024 | 2 | 4 |
| 2025 | 2 | 3 |
| 2026 | 5 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer cleaning method and system23 Jun 2026US 12,666,899 B2Tokyo Electron Limited
- Method for wafer backside polishing26 May 2026US 12,636,749 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for cleaning a semiconductor wafer19 May 2026US 12,635,442 B2Siltronic AG
- Substrate processing method and sublimation drying processing agent17 Feb 2026US 12,557,578 B2SCREEN Holdings Co., Ltd.
- Chemical mechanical polishing cleaning system with temperature control for defect reduction3 Feb 2026US 12,543,524 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Ultra-large-size silicon device with diamond-based heat dissipation and preparation method thereof20 Aug 2026US 2026/0247884 A1Compound Semiconductor (Xiamen) Technology Co., Ltd.
- Method for cleaning a semiconductor wafer30 Jul 2026US 2026/0223618 A1Siltronic AG
- Method of forming a silicon on insulator substrate28 May 2026US 2026/0150592 A1SK hynix Inc.
- Method for processing substrate16 Apr 2026US 2026/0107726 A1Tokyo Electron Limited
- Substrate processing method and substrate processing apparatus1 Jan 2026US 2026/0005009 A1Tokyo Electron Limited
Most cited
By later US patents
- Method and apparatus for removing post-etch residues and other adherent matrices129US 6,228,563 B1GaSonics International · 2001
- Pre-cleaning for silicidation in an SMOS process110US 6,811,448 B1Advanced Micro Devices, Inc. · 2004
- Process for cleaning surface of semiconductor substrate68US 5,221,423 AFujitsu Limited · 1993
- Method and apparatus for removing post-etch residues and other adherent matrices62US 6,333,268 B1Novellus Systems, Inc. · 2001
- Surface treatment to remove impurities in microrecesses58US 4,695,327 APurusar Corporation · 1987