Method for cleaning a semiconductor wafer

A method for cleaning a facing side and a reverse side of a semiconductor wafer, the method comprising, in the order given:

• cleaning the facing side of the semiconductor wafer, the cleaning of the facing side comprising, in the order given:
• a precleaning step with water, the precleaning step executed such that the facing side is still wet as the next cleaning step begins;
• a first cleaning step comprising cleaning with ozonized water and a subsequent rinsing step with purified water;
• a second cleaning step, which comprises a treatment step with ozonized water followed by a treatment step with a liquid containing hydrogen fluoride (HF);
• and
• a third cleaning step comprising cleaning with ozonized water and a subsequent rinsing step with purified water;
• and
• jointly cleaning the facing side and the reverse side of the semiconductor wafer, the jointly cleaning the facing side and the reverse side comprising:
• a fourth cleaning step, which comprises a treatment step with ozonized water followed by a treatment step with a liquid comprising HF, and a drying step, in which both the facing side and the reverse side of the semiconductor wafer are dried.